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- [1] Insulation Simulation Analysis of Press-Pack IGBT PROCEEDINGS OF 2019 IEEE 3RD INTERNATIONAL ELECTRICAL AND ENERGY CONFERENCE (CIEEC), 2019, : 1936 - 1940
- [2] Thermal Network Parameter Extracting Method for Press-Pack IGBT Junction Temperature 2018 IEEE INTERNATIONAL POWER ELECTRONICS AND APPLICATION CONFERENCE AND EXPOSITION (PEAC), 2018, : 881 - 884
- [3] Electric Field Transient Characteristics of High Voltage and High Power Compliant Press-Pack IGBT Device Package Insulation Structure Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2023, 38 (23): : 6253 - 6265
- [4] Thermal Analysis of Press-pack IGBT in Hybrid DC Circuit Breaker PROCEEDINGS OF THE 2021 IEEE 16TH CONFERENCE ON INDUSTRIAL ELECTRONICS AND APPLICATIONS (ICIEA 2021), 2021, : 884 - 888
- [6] Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (11): : 1849 - 1860
- [7] Study on the Effect of Test Condition on Thermal Resistance of the Press-Pack IGBT Module 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
- [9] Design and Implementation of an Experimental Platform for Dynamic Characteristics of Press-Pack IGBT Chip Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2021, 36 (12): : 2471 - 2481
- [10] Simulation of Influence of Unbalanced Clamping Force on Electro-Thermal Characteristics of Press-Pack IGBT Devices Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2019, 34 (16): : 3408 - 3415