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- [24] Power Cycling and Research on Failure Mechanism of Press-Pack IGBT based on Thermal Resistance Composition Testing 2024 4TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND INFORMATION ENGINEERING, EMIE 2024, 2024, : 15 - 18
- [27] Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (02): : 200 - 211
- [28] Condition Monitoring of High Voltage Press-Pack IGBT with On-State Collector-Emitter Voltage PROCEEDINGS OF THE 21ST INTERNATIONAL SYMPOSIUM ON HIGH VOLTAGE ENGINEERING, VOL 1, 2020, 598 : 949 - 957