High Temperature and Thermal Aging Insulation Characteristics of Small Shell and Outer Frame for Press-pack IGBT

被引:0
|
作者
Li, Kaixuan [1 ]
Jiang, Xinyu [1 ]
Yang, Ziyue [1 ]
Yao, Minghan [1 ]
Zhang, Boya [1 ]
Li, Xingwen [1 ]
Mo, Shenyang [2 ]
机构
[1] State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an,710049, China
[2] NARI Group Corporation, State Grid Electric Power Research Institute, Nanjing,211000, China
来源
关键词
Project supported by Headquarters Management Technology Project of SGCC (5500-202240106A-1-1-ZN).(5500-202240106A-1-1-ZN)\u3002 Project supported by Headquarters Management Technology Project of SGCC (5500-202240106A-1-1-ZN);
D O I
10.13336/j.1003-6520.hve.20231070
中图分类号
学科分类号
摘要
引用
收藏
页码:3644 / 3654
相关论文
共 50 条
  • [31] Comparative Analysis of Large-capacity Fully-controlled Press-pack IGBT and IGCT: Principle, Structure, Characteristics and Application
    Zhou W.
    Zeng R.
    Zhao B.
    Chen Z.
    Liu J.
    Bai R.
    Wu J.
    Yu Z.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2022, 42 (08): : 2940 - 2956
  • [32] Explosion Characteristics and Protection Methods of the Shell in Press Pack IGBT Devices Short-circuit Failure
    Zhou Y.
    Tang X.
    Wang L.
    Zhang X.
    Dai A.
    Lin Z.
    Jin R.
    Wei X.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2024, 44 (06): : 2350 - 2361
  • [33] Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications
    Feng, Jingjing
    Mei, Yunhui
    Li, Xianbin
    Lu, Guo-Quan
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 6 (04) : 2245 - 2253
  • [34] An Alternative Junction-to-Case Thermal Resistance Test Method for High Power Press-Pack IGBTs
    Sun, Hongyu
    Sun, Yuan
    Deng, Erping
    Zhao, Yushan
    Li, Weibang
    Pan, Maoyang
    Liu, Peng
    Yan, Yuxing
    Huang, Yongzhang
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (12) : 15644 - 15654
  • [35] Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation
    Guo, Chunsheng
    Cui, Shaoxiong
    Tsai, Wenyi
    Liu, Yunong
    Ding, Juewen
    Li, Jinyuan
    Chen, Zhongyuan
    Li, Yaosheng
    Pan, Shijie
    Feng, Shiwei
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023, 70 (04) : 1776 - 1781
  • [36] Characteristics and Suppression of PETT Oscillation in High-voltage High-power Press Pack IGBT
    Tang X.
    Zhang B.
    Zhang Y.
    Wang L.
    Zhang P.
    Tang, Xinling (tang_xl@ncepu.edu.cn), 1600, Science Press (46): : 1051 - 1058
  • [37] Electro-thermal Modeling for Junction Temperature Cycling-Based Lifetime Prediction of a Press-Pack IGBT 3L-NPC-VSC Applied to Large Wind Turbines
    Senturk, Osman S.
    Helle, Lars
    Munk-Nielsen, Stig
    Rodriguez, Pedro
    Teodorescu, Remus
    2011 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2011, : 568 - 575
  • [38] Junction Temperature Analysis of Press-Pack IG-BTs of Modular Multilevel Converter Based on Electro-Thermal Coupling Model
    Han, Xiaoyun
    Hao, Quanrui
    Li, Dong
    Wang, Shuying
    2019 4TH IEEE WORKSHOP ON THE ELECTRONIC GRID (EGRID), 2019, : 426 - 431
  • [39] Study on Accurate Thermal Modeling of Press-pack IGBT Module with Asymmetric Double-side Cooling Structure based on Structure Function Curve by Orthogonal Experimental Design
    Dou, Zechun
    Dong, Guozhong
    Liu, Guoyou
    Luo, Haihui
    Wang, Yangang
    Wu, Yudong
    Zhou, Zhixiong
    2019 IEEE 13TH INTERNATIONAL CONFERENCE ON POWER ELECTRONICS AND DRIVE SYSTEMS (PEDS), 2019,
  • [40] Converter Structure-Based Power Loss and Static Thermal Modeling of The Press-Pack IGBT Three-Level ANPC VSC Applied to Multi-MW Wind Turbines
    Senturk, Osman S.
    Helle, Lars
    Munk-Nielsen, Stig
    Rodriguez, Pedro
    Teodorescu, Remus
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2011, 47 (06) : 2505 - 2515