Filling contacts and vias: a progress report

被引：0
|
作者：
机构：
来源：
Semicond Int | / 2卷 / 4pp期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Integrated circuit manufacture
引用
收藏
相关论文
共 50 条
  • [41] Theory of filling of high-aspect ratio trenches and vias in presence of additives
    West, AC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (01) : 227 - 232
  • [42] Progress in Filling the Gaps in Bariatric Surgery
    Courcoulas, Anita P.
    JAMA-JOURNAL OF THE AMERICAN MEDICAL ASSOCIATION, 2012, 308 (11): : 1160 - 1161
  • [43] Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages
    Gupta, Parnika
    Morrissey, Padraic E.
    O'Brien, Peter
    Kroehnert, Kevin
    Woehrmann, Markus
    Schiffer, Michael
    Kelb, Christian
    Ambrosius, Norbert
    Schneider-Ramelow, Martin
    2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC, 2022, : 391 - 397
  • [44] Bottom-up Cu filling of annular through silicon vias: Microstructure and texture
    Kim, Sang-Hyeok
    Lee, Hyo-Jong
    Josell, Daniel
    Moffat, Thomas P.
    ELECTROCHIMICA ACTA, 2020, 335
  • [45] MSA as a Supporting Electrolyte in Copper Electroplating for Filling of Damascene Trenches and Through Silicon Vias
    Cho, Sung Ki
    Kim, Myung Jun
    Kim, Jae Jeong
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2011, 14 (05) : D52 - D56
  • [46] Electromigration failure distribution of contacts and vias as a function of stress conditions in submicron IC metallizations
    Oates, AS
    1996 IEEE INTERNATIONAL RELIABILITY PHYSICS PROCEEDINGS, 34TH ANNUAL, 1996, : 164 - 171
  • [47] Application of 3D scatterometry to contacts and vias at 90nm and beyond
    Huang, J
    Barry, K
    Ke, CM
    Lin, B
    Li, A
    Metrology, Inspection, and Process Control for Microlithography XIX, Pts 1-3, 2005, 5752 : 1266 - 1270
  • [48] Effect of Stirring on the Defect-Free Filling of Deep Through-Silicon Vias
    Wang, Feng
    Liu, Ximei
    Liu, Jinzhi
    IEEE ACCESS, 2020, 8 (08): : 108555 - 108560
  • [49] Filling Through-Silicon Vias with Conductive Ferromagnetic Silver-iron Composite
    Lu, Chung-Han
    Wang, Kerwin
    2014 9TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2014, : 366 - 369
  • [50] Polymer Filling of Silicon Trenches for 3-D Through Silicon vias Applications
    Duval, Fabrice F. C.
    Okoro, Chukwudi
    Civale, Yann
    Soussan, Philippe
    Beyne, Eric
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (06): : 825 - 832
12345