Electrical characteristics of multichip module interconnects with perforated reference planes

被引：0
|
作者：
机构：
[1] Cangellaris, Andreas C.
[2] Gribbons, Michael
[3] Prince, John L.
来源：
Cangellaris, Andreas C. | 1600年 / 16期
关键词：
Multichip modules - Software package SPICE;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] 3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects
    Daudlin, Stuart
    Rizzo, Anthony
    Abrams, Nathan C.
    Lee, Sunwoo
    Khilwani, Devesh
    Murthy, Vaishnavi
    Robinson, James
    Collier, Terence
    Molnar, Alyosha
    Bergman, Keren
    2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), 2021,
  • [22] Millimeter-wave characteristics of flip-chip interconnects for multichip modules
    Heinrich, Wolfgang
    Jentzsch, Andrea
    Baumann, Guido
    IEEE Transactions on Microwave Theory and Techniques, 1998, 46 (12 pt 2): : 2264 - 2268
  • [23] Millimeter-wave characteristics of flip-chip interconnects for multichip modules
    Heinrich, W
    Jentzsch, A
    Baumann, G
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) : 2264 - 2268
  • [24] Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
    Yarmchuk, EJ
    Cline, CW
    Bruen, DC
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2005, 49 (4-5) : 677 - 685
  • [25] Thermal characteristics of a multichip module using PF-5060 and water
    Choi, M
    Cho, K
    KSME INTERNATIONAL JOURNAL, 1999, 13 (05): : 443 - 450
  • [26] MULTICHIP MODULE USING MULTILAYER YBA2CU3O7-DELTA INTERCONNECTS
    BURNS, MJ
    CHAR, K
    COLE, BF
    RUBY, WS
    SACHTJEN, SA
    APPLIED PHYSICS LETTERS, 1993, 62 (12) : 1435 - 1437
  • [27] Transient characteristics of a two-phase thermosyphon loop for multichip module
    Nam, SS
    Choi, SB
    Kim, JH
    Kwak, HY
    ETRI JOURNAL, 1998, 20 (03) : 284 - 300
  • [28] Thermal characteristics of a multichip module using PF-5060 and water
    Mingoo Choi
    Keumnam Cho
    KSME International Journal, 1999, 13 : 443 - 450
  • [29] Multichip module with planar-integrated free-space optical vector-matrix-type interconnects
    Gruber, M
    APPLIED OPTICS, 2004, 43 (02) : 463 - 470
  • [30] FINITE-DIFFERENCE TIME-DOMAIN ANALYSIS OF PULSE-PROPAGATION IN MULTICHIP-MODULE INTERCONNECTS
    GRIBBONS, M
    CANGELLARIS, AC
    PRINCE, JL
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05): : 490 - 498
12345