3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

被引：0
|
作者：
Daudlin, Stuart [1 ]
Rizzo, Anthony [1 ]
Abrams, Nathan C. [1 ]
Lee, Sunwoo [2 ]
Khilwani, Devesh [2 ]
Murthy, Vaishnavi [1 ]
Robinson, James [1 ]
Collier, Terence [3 ]
Molnar, Alyosha [2 ]
Bergman, Keren [1 ]
机构：
[1] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA
[2] Cornell Univ, Dept Elect & Comp Engn, Ithaca, NY 14853 USA
[3] CVI, 990 N Bowser Rd, Richardson, TX 75081 USA
来源：
2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC) | 2021年
基金：
美国国家科学基金会;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm(2) bandwidth densities for future co-packaged chipsets. (c) 2021 The Author(s)
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页数：3
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