3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

被引：0

作者：

Daudlin, Stuart ^{[1
]}

Rizzo, Anthony ^{[1
]}

Abrams, Nathan C. ^{[1
]}

Lee, Sunwoo ^{[2
]}

Khilwani, Devesh ^{[2
]}

Murthy, Vaishnavi ^{[1
]}

Robinson, James ^{[1
]}

Collier, Terence ^{[3
]}

Molnar, Alyosha ^{[2
]}

Bergman, Keren ^{[1
]}

机构：

[1] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA

[2] Cornell Univ, Dept Elect & Comp Engn, Ithaca, NY 14853 USA

[3] CVI, 990 N Bowser Rd, Richardson, TX 75081 USA

来源：

2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC) | 2021年

基金：

美国国家科学基金会;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm(2) bandwidth densities for future co-packaged chipsets. (c) 2021 The Author(s)

引用

页数：3

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