SQUARE CHIP RESISTORS ACCELERATE USE OF HIGH-DENSITY MOUNTING.

被引：0

作者：

Kambara, Shigeru

机构：

来源：

JEE, Journal of Electronic Engineering | 1983年 / 20卷 / 198期

关键词：

HIGH-DENSITY MOUNTING - SQUARE CHIP RESISTORS;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：68 / 69

共 50 条

[1] CONNECTOR TECHNOLOGY FOR HIGH-DENSITY MOUNTING.
Hirai, Yuji
JEE. Journal of electronic engineering, 1988, 25 (254): : 37 - 39
[2] ILLUMINATED PUSHBUTTON SWITCHES FOR HIGH-DENSITY MOUNTING.
Kodaira, Yasuo
JEE. Journal of electronic engineering, 1985, 22 (228): : 58 - 61
[3] PIEZOELECTRIC BUZZERS SATISFY HIGH-DENSITY MOUNTING.
Ogawa, Tatsuro
JEE. Journal of electronic engineering, 1988, 25 (254): : 70 - 72
[4] HIGH-DENSITY PACKAGING GOES DENSER WITH QUIPS AND SQUARE-CHIP CARRIERS
GROSSMAN, M
ELECTRONIC DESIGN, 1979, 27 (06) : 36 - &
[5] Electronic chip mounting and high density packaging technology
Koizumi, Mamoru
Anaoh, Kimiharu
JEE. Journal of electronic engineering, 1988, 25 (262): : 38 - 40
[6] TANTALUM CAPACITOR USING FOR VERY HIGH-DENSITY MOUNTING
OOI, M
MUNAKATA, S
SATOU, H
SATOU, H
NEC RESEARCH & DEVELOPMENT, 1989, (95): : 6 - 14
[7] HIGH-DENSITY CHIP CARRIERS AND SOCKETS
GRABBE, DG
SOLID STATE TECHNOLOGY, 1983, 26 (04) : 257 - 258
[8] New technology for high-density LSI mounting in consumer products
Kira, Hidehiko
Takashima, Akira
Ozaki, Yukio
Fujitsu Scientific and Technical Journal, 2007, 43 (01): : 41 - 49
[9] New technology for high-density LSI mounting in consumer products
Kira, Hidehiko
Takashima, Akira
Ozaki, Yukio
FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2007, 43 (01): : 41 - 49
[10] HIGH-DENSITY PROGRAMMABLE LOGIC ARRAY CHIP
WOOD, RA
IEEE TRANSACTIONS ON COMPUTERS, 1979, 28 (09) : 602 - 608