共 50 条
- [41] A DESIGN OF A HIGH-DENSITY MULTILEVEL MATCHING ARRAY CHIP FOR ASSOCIATIVE PROCESSING IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS, 1991, 74 (04): : 918 - 928
- [42] New photosensitive polyimide system for sealing high-density semiconductor chip JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2001, 40 (10): : 6124 - 6128
- [44] Flip-chip BGA applied high-density organic substrate 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 243 - 249
- [45] MINI-FLAT PACKAGE AND HIGH-DENSITY SURFACE MOUNTING TYPE OPIC OUTPUT PHOTOCOUPLER SHARP TECHNICAL JOURNAL, 1989, (43): : 100 - 102
- [46] Via-on-chip package aims at high-rel, high-density ICs ELECTRONIC PRODUCTS MAGAZINE, 1998, 41 (05): : 26 - 26
- [48] Microminiature high-density system modules for space use 2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 1 - 6