Electronic chip mounting and high density packaging technology

被引：0
|
作者：
Koizumi, Mamoru [1 ]
Anaoh, Kimiharu [1 ]
机构：
[1] Murata Manufacturing Co, Japan
来源：
JEE. Journal of electronic engineering | 1988年 / 25卷 / 262期
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摘要：
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页码：38 / 40
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