Design of reliance die attach

被引：0
|
作者：
Hu, J.M. [1 ]
Pecht, M. [1 ]
Dasgupta, A. [1 ]
机构：
[1] Univ of Maryland, College Park, United States
来源：
International Journal of Microcircuits and Electronic Packaging | 1993年 / 16卷 / 01期
关键词：
81;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1 / 21
相关论文
共 50 条
  • [31] MEMS DIE WARPAGE DURING CURING OF DIE ATTACH MATERIAL
    Lee, Hohyung
    Liu, Ruiyang
    Park, Seungbae
    Xue, Xiaojie
    INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 3, 2015,
  • [32] Dicing Die Attach Challenges at Multi Die Stack Packages
    Xian, Tee Swee
    Nanthakumar, Perumal P.
    2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
  • [33] High temperature die-attach effects on die stresses
    Lin, ST
    Benoit, JT
    Grzybowski, RR
    Zou, YD
    Suhling, JC
    Jaeger, RC
    1998 FOURTH INTERNATIONAL HIGH TEMPERATURE ELECTRONICS CONFERENCE, 1998, : 61 - 67
  • [34] MANUFACTURING STRESSES IN THE DIE DUE TO THE DIE-ATTACH PROCESS
    TSAO, PH
    VOLOSHIN, AS
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (01): : 201 - 205
  • [35] Study on Reliability Test of Die Attach Material
    Yik, Lim Chuan
    Kar, Yap Boon
    Shafika, Nor
    2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
  • [36] Soft solder die attach an overview of fundamentals
    Yen, Loh Kim
    Advanced Packaging, 2003, 12 (04): : 27 - 28
  • [37] No-bleed die attach adhesives.
    Gupta, SK
    Neff, B
    Herrington, T
    Liu, P
    Nguyen, M
    Huneke, JT
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 229 : U913 - U913
  • [38] Die attach thermal monitoring of IGBT devices
    Masana, F. N.
    PROCEEDINGS OF THE INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2006, : 421 - 424
  • [39] Processing diagrams for polymeric die attach adhesives
    Hsiung, JC
    Pearson, RA
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 536 - 543
  • [40] Post-cure die attach delamination
    Pare, P
    Roy, M
    1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 162 - 167
12345