Post-cure die attach delamination

被引：0
|
作者：
Pare, P [1 ]
Roy, M [1 ]
机构：
[1] IBM CANADA LTD,BROMONT,PQ J0E 1L0,CANADA
来源：
1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 1996年 / 2920卷
关键词：
die attach; delamination; epoxy; popcorn; plastic;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：162 / 167
页数：6
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