Influence of Ag substrates on grain alignment and critical current density of Bi-2212 tape conductors

被引：0
|
作者：
Kumakura, H. [1 ]
Kitaguchi, H. [1 ]
Togano, K. [1 ]
Muroga, T. [1 ]
Sato, J. [1 ]
Okada, M. [1 ]
机构：
[1] Natl Research Inst for Metals, Ibaraki, Japan
来源：
IEEE Transactions on Applied Superconductivity | 1999年 / 9卷 / 2 II期
关键词：
Bismuth compounds - Coating techniques - Critical current density (superconductivity) - Crystal impurities - Crystal microstructure - Interfaces (materials) - Silver - Superconducting films - Surface roughness - Tapes - X ray diffraction;
D O I：
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学科分类号：
摘要：
We investigated the influence of Ag substrate on the microstructure and Jc values of dip-coated Bi-2212/Ag tapes. The grain alignment of Bi-2212 in the oxide/Ag interface was much higher than that in the free surface of oxide. Jc increases with increasing oxide/Ag interface area and with decreasing oxide layer thickness, while Jc was almost independent of the free surface area. The smoothness of the Ag substrate is also an important factor. Micrometer-size roughness of the Ag substrate results in a decrease of Bi-2212 grain alignment and therefore Jc. Addition of alloying elements to the Ag also degrades the grain alignment of Bi-2212 and decreased Jc. Cold rolling before the heat treatment improved the grain alignment and enhanced Jc.
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页码：1804 / 1807
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