EFFECT OF NITROGEN INCORPORATION ON THE THERMAL STABILITY OF TiW/Al METALLIZATION.

被引:0
|
作者
Gloesener, D. [1 ]
Puylaert, G. [1 ]
van de Wiele, F. [1 ]
机构
[1] UCL, UCL
来源
Vide, les Couches Minces | 1987年 / 42卷 / 236期
关键词
ALUMINUM AND ALLOYS - Applications - INTEGRATED CIRCUITS; VLSI; -; Metallizing; NITROGEN;
D O I
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中图分类号
学科分类号
摘要
The authors report on a systematic study on the influence of nitrogen incorporation in the TiW layer. Rutherford backscattering spectrometry and Auger electron spectroscopy were interactively used. Complementary measurements were carried out by scanning electron microscopy and X-ray photoelectron spectroscopy.
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页码:175 / 177
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