EFFECT OF NITROGEN INCORPORATION ON THE THERMAL STABILITY OF TiW/Al METALLIZATION.

被引:0
|
作者
Gloesener, D. [1 ]
Puylaert, G. [1 ]
van de Wiele, F. [1 ]
机构
[1] UCL, UCL
来源
Vide, les Couches Minces | 1987年 / 42卷 / 236期
关键词
ALUMINUM AND ALLOYS - Applications - INTEGRATED CIRCUITS; VLSI; -; Metallizing; NITROGEN;
D O I
暂无
中图分类号
学科分类号
摘要
The authors report on a systematic study on the influence of nitrogen incorporation in the TiW layer. Rutherford backscattering spectrometry and Auger electron spectroscopy were interactively used. Complementary measurements were carried out by scanning electron microscopy and X-ray photoelectron spectroscopy.
引用
收藏
页码:175 / 177
相关论文
共 50 条
  • [41] CAPACITANCE CONTROL OF THE AL/TIW/AMORPHOUS-SI SYSTEM BY RAPID THERMAL-PROCESSING
    BERGER, S
    KOMEM, Y
    WEISS, BZ
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (01) : 208 - 209
  • [42] Effects of CeO2 incorporation on the performance of a Ta diffusion barrier for Al metallization
    Kim, J
    Kwak, JS
    Yoon, DS
    Baik, HK
    Lee, SM
    JOURNAL OF APPLIED PHYSICS, 1999, 85 (04) : 2170 - 2174
  • [43] Effect of incorporation of nitrogen on calcium hexaaluminate
    Xu, Linchao
    Wang, Enhui
    Hou, Xinmei
    Chen, Junhong
    He, Zhijun
    Liang, Tongxiang
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2020, 40 (15) : 6155 - 6161
  • [44] Nitrogen incorporation and loss during ion nitriding of Al
    Telbizova, T
    Chevolleau, T
    Möller, W
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2001, 184 (03): : 347 - 353
  • [45] Solidification of nitrogen refrigerant and its effect on thermal stability of HTSC tape
    Nakamura, T
    Muta, I
    Okude, K
    Fujio, A
    Hoshino, T
    PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2002, 372 (372-376): : 1434 - 1437
  • [46] Thermal stability of Al3BC3 powders under a nitrogen atmosphere
    Yu, Chao
    Xing, Guangchao
    Ke, Lu
    Ding, Jun
    Di, Jinghui
    Zhu, Hongxi
    Wang, Zhoufu
    Deng, Chengji
    Yu, Puliang
    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2023, 114 (12) : 1138 - 1145
  • [47] Influence of Nitrogen Content on Thermal Stability and Grain Growth Kinetics of Cryomilled Al Nanocomposites
    Hashemi-Sadraei, L.
    Mousavi, S. E.
    Vogt, R.
    Li, Y.
    Zhang, Z.
    Lavernia, E. J.
    Schoenung, J. M.
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2012, 43A (02): : 747 - 756
  • [48] Influence of Nitrogen Content on Thermal Stability and Grain Growth Kinetics of Cryomilled Al Nanocomposites
    L. Hashemi-Sadraei
    S. E. Mousavi
    R. Vogt
    Y. Li
    Z. Zhang
    E. J. Lavernia
    J. M. Schoenung
    Metallurgical and Materials Transactions A, 2012, 43 : 747 - 756
  • [49] Insulation effect on thermal stability of Coated Conductors wires in liquid nitrogen
    Rubeli, Thomas
    Dutoit, Bertrand
    Martynova, Irina
    Makarevich, Artem
    Molodyk, Alexander
    Samoilenkov, Sergey
    26TH INTERNATIONAL CRYOGENIC ENGINEERING CONFERENCE & INTERNATIONAL CRYOGENIC MATERIALS CONFERENCE 2016, 2017, 171
  • [50] The effect of zirconium incorporation on the thermal stability and carbonized product of phenol-formaldehyde resin
    Liu, Changqing
    Li, Kezhi
    Li, Hejun
    Zhang, Shouyang
    Zhang, Yulei
    POLYMER DEGRADATION AND STABILITY, 2014, 102 : 180 - 185