Stress evolution due to electromigration in confined metal lines

被引：0
|
作者：
Korhonen, M.A.
Borgesen, P.
Tu, K.N.
Li, Che-Yu
机构：
来源：
Journal of Applied Physics | 1993年 / 73卷 / 08期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Molecular dynamics simulation of electromigration in nano-sized metal lines
    Ohkubo, T
    Hirotsu, Y
    Nikawa, K
    MATERIALS TRANSACTIONS JIM, 1996, 37 (03): : 454 - 457
  • [42] Resistance degradation in early stage of electromigration of Al(Cu) metal lines
    Guo, Q
    Lo, KF
    Manna, I
    Zeng, X
    Jie, BB
    MICROELECTRONIC YIELD, RELIABILITY, AND ADVANCED PACKAGING, 2000, 4229 : 8 - 12
  • [43] ON VOID NUCLEATION AND GROWTH IN METAL INTERCONNECT LINES UNDER ELECTROMIGRATION CONDITIONS
    NIX, WD
    ARZT, E
    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1992, 23 (07): : 2007 - 2013
  • [44] DEPENDENCE OF ELECTROMIGRATION LIFETIME ON FILM THICKNESS AND LINEWIDTH OF SUBMICRON METAL LINES
    KWOK, T
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (03) : C120 - C120
  • [45] A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines
    Scorzoni, A
    Impronta, M
    De Munari, I
    Fantini, F
    MICROELECTRONICS RELIABILITY, 1999, 39 (05) : 615 - 626
  • [46] Aggravated Electromigration of Copper Interconnection Lines in ULSI Devices Due to Crosstalk Noise
    Livshits, Pavel
    Sofer, Sergey
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2012, 12 (02) : 341 - 346
  • [47] ELECTROMIGRATION FAILURE DUE TO INTERFACIAL DIFFUSION IN FINE AL-ALLOY LINES
    HU, CK
    SMALL, MB
    RODBELL, KP
    STANIS, C
    BLAUNER, P
    HO, PS
    APPLIED PHYSICS LETTERS, 1993, 62 (09) : 1023 - 1025
  • [48] Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines
    Rothe, Susann
    Lienig, Jens
    PROCEEDINGS OF THE 2023 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2023, 2023, : 107 - 114
  • [49] Correlation between stress relaxation and electromigration in Cu/low k lines
    Gan, D
    Yoon, S
    Ho, PS
    ADVANCED METALLIZATION CONFERENCE 2003 (AMC 2003), 2004, : 313 - 318
  • [50] Electromigration and stress-induced voiding in fine Al(Cu) lines
    Hu, CK
    Rodbell, KP
    Lee, KY
    Sullivan, T
    Bouldin, DP
    ULSI SCIENCE AND TECHNOLOGY / 1997: PROCEEDINGS OF THE SIXTH INTERNATIONAL SYMPOSIUM ON ULTRALARGE SCALE INTEGRATION SCIENCE AND TECHNOLOGY, 1997, 1997 (03): : 347 - 366
12345