Stress evolution due to electromigration in confined metal lines

被引：0
|
作者：
Korhonen, M.A.
Borgesen, P.
Tu, K.N.
Li, Che-Yu
机构：
来源：
Journal of Applied Physics | 1993年 / 73卷 / 08期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework
    Zhang, Yanan
    Anicode, Sundaram Vinod K.
    Fan, Xuejun
    Madenci, Erdogan
    COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, 2023, 414
  • [22] A method to predict electromigration failure of metal lines
    Sasagawa, K
    Naito, K
    Saka, M
    Abé, H
    JOURNAL OF APPLIED PHYSICS, 1999, 86 (11) : 6043 - 6051
  • [23] Strain evolution in Al conductor lines during electromigration
    Zhang, H.
    Cargill, G. S., III
    Ge, Y.
    Maniatty, A. M.
    Liu, W.
    JOURNAL OF APPLIED PHYSICS, 2008, 104 (12)
  • [24] A comparison of electromigration failure of metal lines with fracture mechanics
    Abe, Hiroyuki
    Muraoka, Mikio
    Sasagawa, Kazuhiko
    Saka, Masumi
    ACTA MECHANICA SINICA, 2012, 28 (03) : 774 - 781
  • [25] A comparison of electromigration failure of metal lines with fracture mechanics
    Hiroyuki Abé
    Mikio Muraoka
    Kazuhiko Sasagawa
    Masumi Saka
    Acta Mechanica Sinica, 2012, 28 (03) : 774 - 781
  • [26] Effect of metal liner on electromigration in Cu Damascene lines
    Hu, CK
    Gignac, LM
    Liniger, E
    Detavernier, C
    Malhotra, SG
    Simon, A
    JOURNAL OF APPLIED PHYSICS, 2005, 98 (12) : 1 - 8
  • [27] A comparison of electromigration failure of metal lines with fracture mechanics
    Hiroyuki Abé
    Mikio Muraoka
    Kazuhiko Sasagawa
    Masumi Saka
    Acta Mechanica Sinica, 2012, 28 : 774 - 781
  • [28] Saturated voids in interconnect lines due to thermal strains and electromigration
    Zhang, Z
    Suo, ZG
    He, J
    JOURNAL OF APPLIED PHYSICS, 2005, 98 (07)
  • [29] Stress evolution during electromigration in a bamboo structure
    Thouless, MD
    SCRIPTA MATERIALIA, 1996, 34 (12) : 1825 - 1831
  • [30] Model for localized buildup and thinning of metal due to electromigration
    Flinn, P. A.
    Doan, J. C.
    JOURNAL OF APPLIED PHYSICS, 2010, 108 (08)
12345