Temperature stable SAW devices using directly bonded LiTaO3/glass substrates

被引：0

作者：

Sato, H. ^{[1
]}

Onishi, K. ^{[1
]}

Shimamura, T. ^{[1
]}

Tomita, Y. ^{[1
]}

机构：

[1] Matsushita Electric Industrial Co, Ltd, Osaka, Japan

来源：

Proceedings of the IEEE Ultrasonics Symposium | 1998年 / 1卷

关键词：

Bonding - Glass - Lithium compounds - Piezoelectric materials - Single crystals - Thermal expansion - Thermal stress - Thermodynamic stability - Ultrasonic transmission - Ultrasonic velocity;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Temperature-stable surface acoustic wave (SAW) devices were fabricated using a stacking procedure based on the direct bonding of a piezoelectric single crystal LiTaO3 layer on a glass substrates. The piezoelectric layer experienced thermal stress due to the smaller thermal expansion coefficient (TEC) of the glass substrate. By using a glass substrate with small TEC and minimizing the LiTaO3/glass thickness ratio, the temperature coefficient of frequency of the SAW devices was maintained at approximately -6 ppm/°C from -30 °C to 80 °C.

引用

页码：335 / 338

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