Temperature stable SAW devices using directly bonded LiTaO3/glass substrates

被引：0
|
作者：
Sato, H. [1 ]
Onishi, K. [1 ]
Shimamura, T. [1 ]
Tomita, Y. [1 ]
机构：
[1] Matsushita Electric Industrial Co, Ltd, Osaka, Japan
来源：
Proceedings of the IEEE Ultrasonics Symposium | 1998年 / 1卷
关键词：
Bonding - Glass - Lithium compounds - Piezoelectric materials - Single crystals - Thermal expansion - Thermal stress - Thermodynamic stability - Ultrasonic transmission - Ultrasonic velocity;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Temperature-stable surface acoustic wave (SAW) devices were fabricated using a stacking procedure based on the direct bonding of a piezoelectric single crystal LiTaO3 layer on a glass substrates. The piezoelectric layer experienced thermal stress due to the smaller thermal expansion coefficient (TEC) of the glass substrate. By using a glass substrate with small TEC and minimizing the LiTaO3/glass thickness ratio, the temperature coefficient of frequency of the SAW devices was maintained at approximately -6 ppm/°C from -30 °C to 80 °C.
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页码：335 / 338
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