ESD FAILURES OF BOARD-MOUNTED DEVICES.

被引：0

作者：

Neelakantaswamy, Perambur S. ^{[1
]}

Turkman, Rennen I. ^{[1
]}

机构：

[1] RIT Research Corp, Rochester, NY,, USA, RIT Research Corp, Rochester, NY, USA

来源：

Electronic Packaging and Production | 1987年 / 27卷 / 02期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：132 / 134

共 50 条

[31] Numerical heat transfer predictive accuracy for an in-line array of board-mounted plastic quad flat back components in free convection
Eveloy, V
Rodgers, P
Hashmi, MSJ
JOURNAL OF ELECTRONIC PACKAGING, 2005, 127 (03) : 245 - 254
[32] OPTOCOUPLING DEVICES.
Dance, Brian
New Electronics, 1979, 12 (18): : 38 - 52
[33] OPTOELECTRONIC DEVICES.
Huffman, George
EDN, 1980, 25 (19) : 92 - 101
[34] In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique
Gupta, V. (vgupta@seas.ucla.edu), 1600, Taylor and Francis Ltd. (27):
[35] Technical devices.
Minne, HW
JOURNAL OF BONE AND MINERAL RESEARCH, 1999, 14 : S555 - S555
[36] Flexural testing of board mounted wafer level packages for handheld devices
Patwardhan, V
Chin, D
Wong, S
Rey, E
Kelkar, N
Nguyen, L
55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 557 - 561
[37] A visual inspection system for surface mounted devices on printed circuit board
Lin, Shih-Chieh
Su, Chia-Hsin
2006 IEEE CONFERENCE ON CYBERNETICS AND INTELLIGENT SYSTEMS, VOLS 1 AND 2, 2006, : 71 - +
[38] SURFACE-MOUNTED DEVICES IN PRINTED CIRCUIT BOARD ASSEMBLY.
Anon
Electronic components & applications, 1984, 6 (02): : 66 - 70
[39] Molecular devices.
Datta, S
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2003, 226 : U389 - U389
[40] POWER DEVICES.
Anon
Electronic Engineering (London), 1987, 59 (727): : 48 - 68