ESD FAILURES OF BOARD-MOUNTED DEVICES.

被引：0
|
作者：
Neelakantaswamy, Perambur S. [1 ]
Turkman, Rennen I. [1 ]
机构：
[1] RIT Research Corp, Rochester, NY,, USA, RIT Research Corp, Rochester, NY, USA
来源：
Electronic Packaging and Production | 1987年 / 27卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
12
引用
收藏
页码：132 / 134
相关论文
共 50 条
  • [21] An experimental assessment of compact thermal models for the prediction of board-mounted electronic component heat transfer
    Eveloy, V
    Rodgers, P
    DeVoe, J
    Ortega, A
    Hashmi, MSJ
    NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2003, : 300 - 312
  • [22] Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component
    Eveloy, V
    Rodgers, P
    Lohan, J
    ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 36 - 45
  • [23] Real-world printed circuit board ESD failures
    Olney, A
    Gifford, B
    Guravage, J
    Righter, A
    MICROELECTRONICS RELIABILITY, 2005, 45 (02) : 287 - 295
  • [24] BRIDGE-FREE WAVE SOLDERING OF SURFACE MOUNTED DEVICES.
    Klein Wassink, R.J.
    Verguld, M.M.F.
    Brazing & soldering, 1985, (09): : 24 - 27
  • [25] TECHNIQUES AND REQUIREMENTS FOR WAVE-SOLDERING SURFACE MOUNTED DEVICES.
    Verguld, M.M.F.
    Schouten, G.
    Brazing & soldering, 1987, (12): : 48 - 56
  • [26] STANDARD SOLDER PAD LAYOUT FOR SURFACE-MOUNTED DEVICES.
    Anon
    IBM technical disclosure bulletin, 1985, 27 (10 B):
  • [27] IMPACT OF METAL CORED MULTILAYER BOARDS FOR SURFACE MOUNTED DEVICES.
    Wilson, G.C.
    Circuit World, 1987, 13 (04) : 16 - 18
  • [28] Charged Board Model ESD Simulation for PCB Mounted MOS Transistors
    Kuznetsov, Vadim
    Kechiev, Leonid
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2015, 57 (05) : 947 - 954
  • [29] Taking Optics to the Chip: From Board-mounted Optical Assemblies to Chip-level Optical Interconnects
    Schmidtke, Katharine
    Flens, Frank
    Mahgarefteh, Daniel
    2014 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 2014,
  • [30] MEMORY BOARD USING ON-CHIP CACHE CD BUBBLE DEVICES.
    Nagai, H.
    Yamada, Y.
    Suga, S.
    Takahashi, K.
    IEEE translation journal on magnetics in Japan, 1984, TJMJ-1 (03): : 295 - 297
12345