Advanced LSI packaging technologies

被引：0
|
作者：
Hiraiwa, Katsuro
Minamizawa, Masaharu
机构：
来源：
Fujitsu Scientific and Technical Journal | 2000年 / 36卷 / 01期
关键词：
Chip size scale package - Mobile device - Polyimide substrate;
D O I：
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学科分类号：
摘要：
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页码：99 / 107
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