Advanced technologies enhance packaging methods

被引:0
|
作者
Browne, J
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:120 / +
页数:2
相关论文
共 50 条
  • [1] Advanced LSI packaging technologies
    Hiraiwa, K
    Minamizawa, M
    [J]. FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2000, 36 (01): : 99 - 107
  • [2] Advanced packaging technologies for automotive electronics
    Sham, Man-Lung
    Gao, Ziyang
    Leung, Lydia Lap-Wai
    Chen, Yu-Chih
    Chung, Tom
    [J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 59 - +
  • [3] Photolithography Study for Advanced Packaging Technologies
    Suda, Hiromi
    Mizutani, Masaki
    Hirai, Shin-Ichiro
    Mori, Ken-Ichiro
    Miura, Seiya
    [J]. 2016 International Conference on Electronics Packaging (ICEP), 2016, : 577 - 580
  • [4] Advanced Sterilization Technologies Unwrap Packaging Potential
    Sablani, Shyam
    Sand, Claire Koelsch
    [J]. FOOD TECHNOLOGY, 2021, 75 (07) : 62 - 65
  • [5] New material deposition technologies for advanced packaging
    Kloeser, J
    Kasulke, P
    [J]. PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 311 - 315
  • [6] From The ConFab: State of advanced packaging technologies
    Courtemanche, Meredith
    [J]. SOLID STATE TECHNOLOGY, 2012, 55 (06) : 12 - 12
  • [7] Advanced packaging technologies in MOSFETs for power management
    Tsui, A
    Sarkis, J
    Chen, H
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 147 - 150
  • [8] Review of the reliability of advanced component packaging technologies
    Németh, P
    Illyefalvi-Vitéz, Z
    Harsányi, G
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1605 - 1609
  • [9] Die singulation technologies for advanced packaging: A critical review
    Lei, Wei-Sheng
    Kumar, Ajay
    Yalamanchili, Rao
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2012, 30 (04):
  • [10] Development of Packaging Technologies for Advanced SiC Power Modules
    Liang, Zhenxian
    Wang, Fred
    Tolbert, Leon
    [J]. 2014 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2014, : 41 - 46