共 50 条
- [1] Advanced LSI packaging technologies [J]. FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2000, 36 (01): : 99 - 107
- [2] Advanced packaging technologies for automotive electronics [J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 59 - +
- [3] Photolithography Study for Advanced Packaging Technologies [J]. 2016 International Conference on Electronics Packaging (ICEP), 2016, : 577 - 580
- [5] New material deposition technologies for advanced packaging [J]. PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 311 - 315
- [7] Advanced packaging technologies in MOSFETs for power management [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 147 - 150
- [8] Review of the reliability of advanced component packaging technologies [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1605 - 1609
- [9] Die singulation technologies for advanced packaging: A critical review [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2012, 30 (04):
- [10] Development of Packaging Technologies for Advanced SiC Power Modules [J]. 2014 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2014, : 41 - 46