Advanced Sterilization Technologies Unwrap Packaging Potential

被引:0
|
作者
Sablani, Shyam [1 ]
Sand, Claire Koelsch [1 ]
机构
[1] Washington State Univ, Dept Biol Syst Engn, Food Engn, Pullman, WA 99164 USA
关键词
D O I
暂无
中图分类号
TS2 [食品工业];
学科分类号
0832 ;
摘要
引用
收藏
页码:62 / 65
页数:4
相关论文
共 50 条
  • [1] Advanced LSI packaging technologies
    Hiraiwa, Katsuro
    Minamizawa, Masaharu
    [J]. Fujitsu Scientific and Technical Journal, 2000, 36 (01): : 99 - 107
  • [2] Advanced LSI packaging technologies
    Hiraiwa, K
    Minamizawa, M
    [J]. FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2000, 36 (01): : 99 - 107
  • [3] Advanced packaging technologies for automotive electronics
    Sham, Man-Lung
    Gao, Ziyang
    Leung, Lydia Lap-Wai
    Chen, Yu-Chih
    Chung, Tom
    [J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 59 - +
  • [4] Advanced technologies enhance packaging methods
    Browne, J
    [J]. MICROWAVES & RF, 1999, 38 (02) : 120 - +
  • [5] Photolithography Study for Advanced Packaging Technologies
    Suda, Hiromi
    Mizutani, Masaki
    Hirai, Shin-Ichiro
    Mori, Ken-Ichiro
    Miura, Seiya
    [J]. 2016 International Conference on Electronics Packaging (ICEP), 2016, : 577 - 580
  • [6] PACKAGING FOR STERILIZATION
    GUISE, B
    [J]. MANUFACTURING CHEMIST, 1983, 54 (01): : 38 - 40
  • [7] New material deposition technologies for advanced packaging
    Kloeser, J
    Kasulke, P
    [J]. PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 311 - 315
  • [8] From The ConFab: State of advanced packaging technologies
    Courtemanche, Meredith
    [J]. SOLID STATE TECHNOLOGY, 2012, 55 (06) : 12 - 12
  • [10] Review of the reliability of advanced component packaging technologies
    Németh, P
    Illyefalvi-Vitéz, Z
    Harsányi, G
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1605 - 1609