Effects of assembly methodology on manufacturing induced stresses in μBGA packages

被引：0
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作者：
Tsao, Pei-Haw [1 ]
Chen, Chun-Liang [1 ]
Huang, Yu-Jen [1 ]
Huang, Chender [1 ]
机构：
[1] Vanguard Int Semiconductor Corp, Hsinchu, Taiwan
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
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页码：653 / 656
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