user

Effects of solder joint shapes on reliability of BGA packages under board level drop impact loads

被引：0
|
作者：
Yang, Xue-Xia [1 ]
Xiao, Ge-Sheng [1 ]
Shu, Xue-Feng [1 ]
机构：
[1] Institute of Applied Mechanics and Bio-Medical Engineering, Taiyuan University of Technology, Taiyuan 030024, China
来源：
Zhendong yu Chongji/Journal of Vibration and Shock | 2013年 / 32卷 / 01期
关键词：
Ball grid arrays - Drops - Finite element method - Numerical methods - Reliability analysis - Cylinders (shapes);
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：104 / 107
相关论文
共 50 条
  • [1] Board Level Solder Joint Assembly and Reliability for Ultra Thin BGA Packages
    Hossain, Mohammad M.
    Aravamudhan, Srinivasa R.
    Nowakowski, Marilyn
    Ma, Xiaoqing
    Walwadkar, Satyajit S.
    Kulkarni, Vijay
    Muthukumar, Sriram
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 43 - 48
  • [2] Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact
    Liu, Fang
    Meng, Guang
    Zhao, Mei
    Zhao, Jun feng
    MICROELECTRONICS RELIABILITY, 2009, 49 (01) : 79 - 85
  • [3] Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages
    Tee, TY
    Zhong, ZW
    MICROELECTRONICS RELIABILITY, 2004, 44 (12) : 1957 - 1965
  • [4] Effect of compression loads on the solder joint reliability of flip chip BGA packages
    Garner, L
    Zhang, C
    Beh, KS
    Helms, K
    Tan, YL
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 692 - 698
  • [5] Dynamic responses and solder joint reliability under board level drop test
    Luan, Jing-en
    Tee, Tong Yan
    Pek, Eric
    Lim, Chwee Teck
    Zhong, Zhaowei
    MICROELECTRONICS RELIABILITY, 2007, 47 (2-3) : 450 - 460
  • [6] Board Level Solder Joint Reliability Model for Flip-Chip Ball Grid Array Packages under Compressive Loads
    Chiu, Tz-Cheng
    Lin, Jyun-Ji
    Gupta, Vikas
    Edwards, Darvin
    Ahmad, Mudasir
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 646 - 651
  • [7] Effects of Solder Joint Shape on Joint Reliability Under Drop Impact Loadings
    Yang, Xuexia
    Li, Zhigang
    Yuan, Guozheng
    Shu, Xuefeng
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1206 - 1209
  • [8] Introduction of a New Metric for the Solder Joint Reliability Assessment of BGA Packages on System Level
    Schempp, Fabian
    Dressler, Marc
    Kraetschmer, Daniel
    Loerke, Friederike
    Wilde, Juergen
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 2192 - 2197
  • [9] Impact of fatigue modeling on 2nd level joint reliability of BGA packages with SnAgCu solder balls
    Stoeckl, S
    Yeo, A
    Lee, C
    Pape, H
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 857 - 862
  • [10] Modeling Solder Joint Reliability of VFBGA Packages under Board Level Drop Test Based on Dynamic Constitutive Relation with Thermal Effect
    Niu, Xiaoyan
    Chen, Tong
    Li, Zhigang
    Shu, Xuefeng
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 289 - 293
12345