Effects of solder joint shapes on reliability of BGA packages under board level drop impact loads

被引：0
|
作者：
Yang, Xue-Xia [1 ]
Xiao, Ge-Sheng [1 ]
Shu, Xue-Feng [1 ]
机构：
[1] Institute of Applied Mechanics and Bio-Medical Engineering, Taiyuan University of Technology, Taiyuan 030024, China
来源：
Zhendong yu Chongji/Journal of Vibration and Shock | 2013年 / 32卷 / 01期
关键词：
Ball grid arrays - Drops - Finite element method - Numerical methods - Reliability analysis - Cylinders (shapes);
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：104 / 107
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