Effect of surface preparation in butt joint between aluminum alloy and ceramics using a room temperature bonding method

被引：0
|
作者：
Takaci, Hideki
Maeda, Ryutaro
Yamamoto, Hideo
机构：
来源：
Kikai Gijutsu Kenkyusho Shoho/Journal of Mechanical Engineering Laboratory | 1992年 / 46卷 / 06期
关键词：
10;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：463 / 469
相关论文
共 50 条
  • [1] EFFECT OF SURFACE PREPARATION IN BUTT JOINT BETWEEN ALUMINUM-ALLOY AND CERAMICS USING A ROOM-TEMPERATURE BONDING METHOD
    TAKAGI, H
    MAEDA, R
    YAMAMOTO, H
    JOURNAL OF MECHANICAL ENGINEERING LABORATORY, 1992, 46 (06): : 463 - 469
  • [2] Room Temperature Wafer Bonding Using Surface Activated Bonding Method
    Taniyama, Shingo
    Wang, Ying-Hui
    Fujino, Masahisa
    Suga, Tadatomo
    IEEE 9TH VLSI PACKAGING WORKSHOP IN JAPAN, 2008, : 141 - 144
  • [3] Effect of ultrasonic impact treatment on surface microstructure and fatigue properties of 6082 aluminum alloy butt joint
    He, Bolin
    Feng, Yaming
    Li, Li
    Chen, Zhaoxia
    MODERN PHYSICS LETTERS B, 2018, 32 (21):
  • [4] Room temperature vacuum sealing using surface activated bonding method
    Itoh, T
    Okada, H
    Takagi, H
    Maeda, R
    Suga, T
    BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2003, : 1828 - 1831
  • [5] Surface activated bonding of aluminum oxide films at room temperature
    Utsumi, Jun
    Takigawa, Ryo
    SCRIPTA MATERIALIA, 2021, 191 : 215 - 218
  • [6] Effect of the surface roughness on room temperature bonding
    Hosoda, Naoe
    Suga, Tadatomo
    Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2000, 69 (02): : 54 - 57
  • [7] Room temperature Cu-Cu direct bonding using surface activated bonding method
    Kim, TH
    Howlader, MMR
    Itoh, T
    Suga, T
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (02): : 449 - 453
  • [8] Room Temperature Bonding of Polymer to Glass Wafer using Surface Activated Bonding (SAB) Method
    Matsumae, T.
    Nakano, M.
    Matsumoto, Y.
    Suga, T.
    SEMICONDUCTOR WAFER BONDING 12: SCIENCE, TECHNOLOGY, AND APPLICATIONS, 2012, 50 (07): : 297 - 302
  • [9] Room Temperature Bonding with Polymethylglutarimide Using the Surface Activated Bonding Method for a Layer Transfer Platform
    Matsumae, Takashi
    Fujino, Masahisa
    Suga, Tadatomo
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (08) : P512 - P516
  • [10] Room Temperature Bonding method for polymer films by Surface Activated Bonding method using Al intermediate layer
    Matsumae, Takashi
    Fujino, Masahisa
    Suga, Tadatomo
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 204 - 207
12345