Room Temperature Bonding method for polymer films by Surface Activated Bonding method using Al intermediate layer

被引：0
|
作者：
Matsumae, Takashi [1 ]
Fujino, Masahisa [1 ]
Suga, Tadatomo [1 ]
机构：
[1] Univ Tokyo, Sch Engn, Dept Precis Engn, Bunkyo Ku, Tokyo, Japan
来源：
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2014年
关键词：
polymer bonding; room temperature bonding; modified Surface Activated Bonding method; SAB METHOD;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
For a sealing of organic electro luminescence displays and lightings, it is required that polymer films are bonded at room temperature without organic adhesives. A new bonding technique called modified surface activated bonding (mSAB) was presented to meet the requirement. However, the bonding fails particularly when vacuum condition isn't good (around 10(-5) Pa). To solve the problem, polymer films are tried to bond using metal intermediate layer instead of Si adhesion layer used in the previous study. As a result, unbonded areas are reduced by means of the mSAB using Al intermediate layer.
引用
收藏
页码：204 / 207
页数：4
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