Reduction of damage of soldering iron tip by addition of co and Ni To Sn-Ag-Cu lead-free solder

被引：0
|
作者：
Takemoto, Tadashi [1 ]
Tomitsuka, Ken-Ichi [2 ]
Tooyama, Toshio [2 ]
Nishikawa, Hiroshi [1 ]
机构：
[1] Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan
[2] Sony EMCS Corporation, Ichinomiya, Aichi, Japan
来源：
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society | 2009年 / 27卷 / 02期
关键词：
D O I：
10.2207/qjjws.27.209s
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures
    Xinmeng Zhai
    Yue Chen
    Yuefeng Li
    Jun Zou
    Mingming Shi
    Bobo Yang
    Yang Li
    Chunfeng Guo
    Rongrong Hu
    Qijun Bao
    Journal of Electronic Materials, 2021, 50 : 5965 - 5980
  • [22] Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures
    Zhai, Xinmeng
    Chen, Yue
    Li, Yuefeng
    Zou, Jun
    Shi, Mingming
    Yang, Bobo
    Li, Yang
    Guo, Chunfeng
    Hu, Rongrong
    Bao, Qijun
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (10) : 5965 - 5980
  • [23] Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes
    Vuorinen, V.
    Laurila, T.
    Yu, H.
    Kivilahti, J.K.
    Journal of Applied Physics, 2006, 99 (02): : 1 - 6
  • [24] Creep Behavior of Lead-Free Sn-Ag-Cu plus Ni-Ge Solder Alloys
    Hidaka, N.
    Watanabe, H.
    Yoshiba, M.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (05) : 670 - 677
  • [25] Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes
    Vuorinen, V
    Laurila, T
    Yu, H
    Kivilahti, JK
    JOURNAL OF APPLIED PHYSICS, 2006, 99 (02)
  • [26] Reliability and Microstructural Studies of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering
    Mostofizadeh, M.
    Kokko, K.
    Frisk, L.
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 2163 - 2170
  • [27] Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder
    Ali, H. Elhosiny
    El-Taher, A. M.
    Algarni, H.
    MATERIALS TODAY COMMUNICATIONS, 2024, 39
  • [28] Microstructures and properties of Sn-Ag-Cu lead-free solder alloys containing La
    Zhou Ying-chun
    Pan Qing-lin
    He Yun-bin
    Liang Wen-jien
    Li Wen-bin
    Li Yun-chun
    Lu Cong-ge
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2007, 17 : S1043 - S1048
  • [29] Effects of intermetallic compounds on the properties of Sn-Ag-Cu lead-free solder joints
    College of Materials Science and Engineering, Jilin University, Changchun 130022, China
    Jilin Daxue Xuebao (Gongxueban), 2006, 6 (846-850):
  • [30] Plastic characterization and performance of Sn-Ag-Cu lead-free BGA solder joint
    School of Material Science and Engineering, Harbin University of Technology, Harbin
    150080, China
    不详
    150081, China
    Zhongguo Youse Jinshu Xuebao, 11 (3119-3125):
12345