Plastic characterization and performance of Sn-Ag-Cu lead-free BGA solder joint

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作者：
School of Material Science and Engineering, Harbin University of Technology, Harbin [1 ]
150080, China
不详 [2 ]
150081, China
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来源：
Zhongguo Youse Jinshu Xuebao | / 11卷 / 3119-3125期
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Compendex;
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摘要：
Nanoindentation
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