Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints

被引：11
|
作者：
Dong, Wenxing [1 ]
Shi, Yaowu [1 ]
Lei, Yongping [1 ]
Xia, Zhidong [1 ]
Guo, Fu [1 ]
机构：
[1] Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2009年 / 38卷 / 09期
关键词：
Lead-free solder; solidification cracks; Sn-Ag-Cu solder alloy; small elemental additions; RARE-EARTH ADDITIONS; PHOSPHORUS; MICROSTRUCTURE; ALLOY;
D O I：
10.1007/s11664-009-0839-7
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the present work, solidification cracks in Sn-Ag-Cu solder joints were investigated. Experimental results indicate that solidification cracks existed in significant numbers in the miniature Sn-Ag-Cu solder joints. In order to create solidification cracks in the miniature solder joints during solidification and evaluate the susceptibility of Sn-Ag-Cu alloys to solidification cracking, a copper self-restraint specimen was designed, which can simulate the process of solidification crack formation. The solidification crack susceptibility of the Sn-Ag-Cu solder alloy was evaluated using the total crack length of the solder joint. In addition, the effect of trace amounts of elemental additions on solidification cracking of Sn-Ag-Cu solder joints was studied. It was found that adding trace amounts of Ni or Ce could depress the solidification cracks in Sn-3.0Ag-0.5Cu solder joints. However, P additions aggravated the formation of solidification cracks.
引用
收藏
页码：1906 / 1912
页数：7
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