Reduction of damage of soldering iron tip by addition of co and Ni To Sn-Ag-Cu lead-free solder

被引：0
|
作者：
Takemoto, Tadashi [1 ]
Tomitsuka, Ken-Ichi [2 ]
Tooyama, Toshio [2 ]
Nishikawa, Hiroshi [1 ]
机构：
[1] Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan
[2] Sony EMCS Corporation, Ichinomiya, Aichi, Japan
来源：
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society | 2009年 / 27卷 / 02期
关键词：
D O I：
10.2207/qjjws.27.209s
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学科分类号：
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