Lead-free solder and the rework process

被引：0
|
作者：
机构：
来源：
SMT Surf Mount Technol Mag | 2006年 / 4卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Lead-free solder quality investigation
    Szendiuch, Ivan
    Vasko, Cyril
    Cejtchaml, Pavel
    2006 29TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2006, : 219 - +
  • [32] The status of lead-free solder alloys
    Seelig, K
    Suraski, D
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1405 - 1409
  • [33] NCMS Lead-free Solder Project
    Prasad, Ray P.
    Surface mount technology, 2000, 14 (02):
  • [34] Concerns over lead-free solder
    Elektron, 2006, 6 (17):
  • [35] A Compliant Lead-Free Solder Alloy
    Sabri, Mohd Faizul Mohd
    Shnawah, Dhafer Abdul-Ameer
    Badruddin, Irfan Anjum
    Said, Suhana Binti Mohd
    2012 10TH IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE), 2012, : 453 - 457
  • [36] Zeroing in on a lead-free solder database
    Siewert, TA
    Smith, DR
    Madeni, JC
    Liu, S
    WELDING JOURNAL, 2005, 84 (10) : 30 - 31
  • [37] Lead-free solder takes the heat
    不详
    MATERIALS PERFORMANCE, 1998, 37 (02) : 110 - 110
  • [38] New lead-free solder alloy
    Kamal, M
    Meikhail, MS
    El-Bediwi, AB
    Gouda, ES
    RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2005, 160 (07): : 301 - 312
  • [39] NCMS Lead-free Solder Project
    Artaki, Iris
    Noctor, Donna
    Desantis, Charles
    Desaulnier, Willie
    Felton, Lawrence
    Palmer, Mark
    Felty, Joe
    Greaves, John
    Handwerker, Carol
    Mather, John
    Schroeder, Scott
    Napp, Duane
    Pan, Tsung-Yu
    Rosser, Jerald
    Vianco, Paul
    et al.
    SMT Surface Mount Technology Magazine, 2000, 14 (02):
  • [40] Sapphire wafer bumping by lead-free solder paste printing process
    Yang, Zhiyuan
    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 902 - 905
12345