A Compliant Lead-Free Solder Alloy

被引：0

作者：

Sabri, Mohd Faizul Mohd ^{[1
]}

Shnawah, Dhafer Abdul-Ameer ^{[1
]}

Badruddin, Irfan Anjum ^{[1
]}

Said, Suhana Binti Mohd ^{[1
]}

机构：

[1] Univ Malaya, Dept Mech Engn, Kuala Lumpur 50603, Malaysia

来源：

2012 10TH IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE) | 2012年

关键词：

SN-AG-CU; DROP IMPACT RELIABILITY; TENSILE PROPERTIES; JOINTS; MICROSTRUCTURES; ELEMENTS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of 0.5 wt.% Fe addition on the microstructural and mechanical properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy were investigated. The addition of Fe leads to the formation of large FeSn2 intermetallic compound (IMC) particles located in the eutectic regions besides the small Ag3Sn and Cu6Sn5 IMC particles. The addition of Fe also leads to enlarge the primary beta-Sn grains and diminish the eutectic regions. The formation of large FeSn2 IMC particles together with the presence of large primary beta-Sn grains leads to significantly lower elastic modulus and yield strength values for Fe-bearing SAC105 solder alloy. Moreover, the presence of large primary beta-Sn grains causes the Fe-bearing solder alloy to maintain the total elongation at the level of SAC105 solder alloy. This effect can increase the bulk compliance and plastic energy dissipation ability of the solder joint, which play an important role in drop impact performance enhancement.

引用

页码：453 / 457

页数：5

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