Lead-free solder

被引:0
|
作者
Black, H
机构
关键词
D O I
暂无
中图分类号
O69 [应用化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:22 / 23
页数:2
相关论文
共 50 条
  • [1] In pursuit of lead-free solder
    Birch, S
    [J]. AEROSPACE ENGINEERING, 2002, 22 (05) : 12 - 12
  • [2] The lead-free solder challenge
    Frear, Darrel
    [J]. Semicond Int, 11 (SP-20):
  • [3] The move to lead-free solder
    Woods, S
    [J]. CONNECTOR SPECIFIER, 2002, 18 (11) : 24 - 24
  • [4] Solder balling of lead-free solder pastes
    Minna Arra
    Dongkai Shangguan
    Erro Ristolainen
    Toivo Lepistö
    [J]. Journal of Electronic Materials, 2002, 31 : 1130 - 1138
  • [5] Solder balling of lead-free solder pastes
    Arra, M
    Shangguan, D
    Ristolainen, E
    Lepistö, T
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) : 1130 - 1138
  • [6] Lead-free Flux Effect in Lead-free Solder Joint Improvement
    Leng, Eu Poh
    Ding, Min
    Ahmad, Ibrahim
    Jiun, Hoh Huey
    Hazlinda, Kamarudin
    [J]. IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 541 - 548
  • [7] Reliability of solder joints assembled with lead-free solder
    Ochiai, M
    Akamatsu, T
    Ueda, H
    [J]. FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2002, 38 (01): : 96 - 101
  • [8] The status of lead-free solder alloys
    Seelig, K
    Suraski, D
    [J]. ADVANCED ELECTRONICS ASSEMBLY - A SYMPOSIUM ON LEAD FREE INTERCONNECT TECHNOLOGY, PROCEEDINGS OF THE TECHNICAL PROGRAM, 2000, : 36 - 41
  • [9] Current trends in lead-free solder
    Dowds, Steve
    Products, Solder
    Henkel, H.
    [J]. SMT Surface Mount Technology Magazine, 2004, 18 (01):
  • [10] Reliability of lead-free solder alloys
    Igoshev, V
    Kleiman, J
    [J]. ENVIRONMENT CONSCIOUS MATERIALS - ECOMATERIALS, 2000, : 703 - 715