共 50 条
- [41] Lead-free solder bumping process for high temperature automotive application 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1468 - 1471
- [42] A Novel Process for Separating Silver from Waste Lead-free Solder JIM EVANS: HONORARY SYMPOSIUM, 2010, 2010, : 309 - 316
- [44] Developing a repeatable and reliable rework process for lead-free fine-pitch BGAs IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (04): : 270 - 278
- [45] Microstructure of a lead-free composite solder produced by an in-situ process Journal of Electronic Materials, 2002, 31 : 1304 - 1308
- [46] Rework and reliability of QFP and BGA lead-free assemblies PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 194 - 199
- [47] Research trends in lead-free soldering in the US: NCMS lead-free solder project FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 1999, : 602 - 605
- [48] Solder paste with polymerizing flux for lead-free solder alloy 2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 535 - 540