Low-Power and wideband inductive-coupling communication for 3D integration

被引：0
|
作者：
Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama-shi, Kanagawa 223-8522, Japan [1 ]
机构：
来源：
J. Jpn. Inst. Electron. Packag. | 2008年 / 3卷 / 174-181期
关键词：
D O I：
10.5104/jiep.11.174
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] A 65 fJ/b Inductive-Coupling Inter-Chip Transceiver Using Charge Recycling Technique for Power-Aware 3D System Integration
    Niitsu, Kiichi
    Kawaj, Shusuke
    Miura, Noriyuki
    Ishikuro, Hiroki
    Kuroda, Tadahiro
    2008 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE, 2008, : 97 - 100
  • [22] Rotary Coding for Power Reduction and S/N Improvement in Inductive-Coupling Data Communication
    Radecki, Andrzej
    Miura, Noriyuki
    Ishikuro, Hiroki
    Kuroda, Tadahiro
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2012, 47 (11) : 2643 - 2653
  • [23] An Inductive-Coupling Link for 3-D Network-on-Chips
    Kadomoto, Junichiro
    Amano, Hideharu
    Kuroda, Tadahiro
    PROCEEDINGS INTERNATIONAL SOC DESIGN CONFERENCE 2017 (ISOCC 2017), 2017, : 150 - 151
  • [24] 3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link
    Saen, Makoto
    Osada, Kenichi
    Okuma, Yasuyuki
    Niitsu, Kiichi
    Shimazaki, Yasuhisa
    Sugimori, Yasufumi
    Kohama, Yoshinori
    Kasuga, Kazutaka
    Nonomura, Itaru
    Irie, Naohiko
    Hattori, Toshihiro
    Hasegawa, Atsushi
    Kuroda, Tadahiro
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2010, 45 (04) : 856 - 862
  • [25] Wideband inductive-coupling interface for high-performance portable system
    Ishikuro, Hiroki
    Miura, Noriyuki
    Kuroda, Tadahiro
    PROCEEDINGS OF THE IEEE 2007 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2007, : 13 - +
  • [26] Design and Theoretical Analysis of Bit Error Rate (BER)-modulated Inductive-coupling Transceiver Using Dynamic Intermediate Interference Control Technique for Low-power Communication
    Xu, Ge
    Hayashi, Kenya
    Arata, Shigeki
    Murakami, Shunya
    Bui, Dang Cong
    Kobayashi, Atsuki
    Niitsu, Kiichi
    SENSORS AND MATERIALS, 2020, 32 (08) : 2631 - 2639
  • [27] Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces
    Kagami, Takahiro
    Matsutani, Hiroki
    Koibuchi, Michihiro
    Take, Yasuhiro
    Kuroda, Tadahiro
    Amano, Hideharu
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 24 (02) : 493 - 506
  • [28] A single phase modulation for pulse-based inductive-coupling connection in 3D stacked chip
    Zhang, Li
    Xu, Xiaowei
    Li, Dawei
    Chen, Xiaofei
    Zou, Xuecheng
    IEICE ELECTRONICS EXPRESS, 2017, 14 (20):
  • [29] Circuit and Device Interactions for 3D Integration Using Inductive Coupling
    Kuroda, Tadahiro
    2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2014,
  • [30] A Wideband and Low-Power Distributed Cascode Mixer Using Inductive Feedback
    Kim, Jihoon
    SENSORS, 2022, 22 (22)
12345