Circuit and Device Interactions for 3D Integration Using Inductive Coupling

被引：0
|
作者：
Kuroda, Tadahiro [1 ]
机构：
[1] Keio Univ, Yokohama, Kanagawa 223, Japan
来源：
2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2014年
关键词：
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
This paper presents a ThruChip Interface using inductive coupling and Highly Doped Silicon Via for power delivery. Design automation, manufacturability, applications, and scaling scenario are discussed.
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页数：4
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