Low-Power and wideband inductive-coupling communication for 3D integration

被引：0
|
作者：
Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama-shi, Kanagawa 223-8522, Japan [1 ]
机构：
来源：
J. Jpn. Inst. Electron. Packag. | 2008年 / 3卷 / 174-181期
关键词：
D O I：
10.5104/jiep.11.174
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration
    Thorolfsson, Thorlindur
    Melamed, Samson
    Davis, W. Rhett
    Franzon, Paul D.
    ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2010, 16 (01)
  • [32] Edge effect aware low-power crosstalk avoidance technique for 3D integration
    Bamberg, Lennart
    Najafi, Amir
    Garcia-Ortiz, Alberto
    INTEGRATION-THE VLSI JOURNAL, 2019, 69 : 98 - 110
  • [33] Asynchronous Pulse Transmitter for Power Reduction in Inductive-Coupling Link
    Saito, Mitsuko
    Miura, Noriyuki
    Kuroda, Tadahiro
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2012, 51 (02)
  • [34] Low-power Inductive-coupling Transmitter Using Supply-insensitive Auxiliary Driving Switch under Supply-voltage Fluctuation
    Nishio, Yuya
    Kobayashi, Atsuki
    Niitsu, Kiichi
    SENSORS AND MATERIALS, 2020, 32 (08) : 2615 - 2630
  • [35] 3D serial TSV link for low-power chip-to-chip communication
    Beanato, Giulia
    Cevrero, Alessandro
    De Micheli, Giovanni
    Leblebici, Yusuf
    2014 IEEE INTERNATIONAL CONFERENCE ON IC DESIGN & TECHNOLOGY (ICICDT), 2014,
  • [36] Coding Approach for Low-Power 3D Interconnects
    Bamberg, Lennart
    Schmidt, Robert
    Garcia-Ortiz, Alberto
    2018 55TH ACM/ESDA/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2018,
  • [37] A 50% power reduction in inductive-coupling transceiver for 3D-stacked inter-chip data link
    Zhang, Li
    Li, Tie
    Wang, Baocun
    Zou, Xuecheng
    7TH IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE (INEC) 2016, 2016,
  • [38] Low-power 3D integrated ferromagnetic computing
    Becherer, M.
    Breitkreutz, S.
    Eichwald, I.
    Ziemys, G.
    Kiermaier, J.
    Csaba, G.
    Schmitt-Landsiedel, D.
    2015 JOINT INTERNATIONAL EUROSOI WORKSHOP AND INTERNATIONAL CONFERENCE ON ULTIMATE INTEGRATION ON SILICON (EUROSOI-ULIS), 2015, : 121 - 124
  • [39] A Novel Low Inductive 3D SiC Power Module Based on Hybrid Packaging and Integration Method
    Huang, Zhizhao
    Li, Yuxiong
    Chen, Lichuan
    Tan, Yifan
    Chen, Cai
    Kang, Yong
    Luo, Fang
    2017 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2017, : 3995 - 4002
  • [40] Daisy chain transmitter for power reduction in inductive-coupling CMOS link
    Niitsu, Kiichi
    Miura, Noriyuki
    Inoue, Mari
    Nakagawa, Yoshihiro
    Tago, Masamoto
    Mizuno, Masayuki
    Sakurai, Takayasu
    Kuroda, Tadahiro
    IEICE TRANSACTIONS ON ELECTRONICS, 2007, E90C (04) : 829 - 835
12345