Microstructure and performance of SnAgCuEr lead-free solders with rare earth

被引:0
|
作者
Tian, Jun [1 ]
Hao, Hu [1 ]
Shi, Yao-Wu [1 ]
Lei, Yong-Ping [1 ]
Xia, Zhi-Dong [1 ]
机构
[1] School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:281 / 283
相关论文
共 50 条
  • [41] Lead-free solders for electronic assembly
    Hua, F
    Glazer, J
    DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 65 - 73
  • [42] INVESTIGATION OF MULTICOMPONENT LEAD-FREE SOLDERS
    Gyenes, A.
    Benke, M.
    Teglas, N.
    Nagy, E.
    Gacsi, Z.
    ARCHIVES OF METALLURGY AND MATERIALS, 2017, 62 (02) : 1071 - 1074
  • [43] Probing lead-free solders in electronics
    Mehta, Rupal
    MATERIALS WORLD, 2009, 17 (08) : 14 - 14
  • [44] Lead-free electronic solders - Preface
    Subramanian, K. N.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 1 - 2
  • [45] Characters of multicomponent lead-free solders
    N. Zhao
    X. Y. Liu
    M. L. Huang
    H. T. Ma
    Journal of Materials Science: Materials in Electronics, 2013, 24 : 3925 - 3931
  • [46] Composite lead-free electronic solders
    Guo, Fu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 129 - 145
  • [47] Creep phenomena in lead-free solders
    Igoshev, VI
    Kleiman, JI
    JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (02) : 244 - 250
  • [48] Characters of multicomponent lead-free solders
    Zhao, N.
    Liu, X. Y.
    Huang, M. L.
    Ma, H. T.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (10) : 3925 - 3931
  • [49] Challenges in attaining lead-free solders
    Baskin, Philip
    WELDING JOURNAL, 2007, 86 (03) : 58 - 61
  • [50] Constitutive modeling of lead-free solders
    Pei, M
    Qu, J
    2005 10TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2005, : 45 - 49