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Lead-free solders for electronic assembly

被引：0
|
作者：
Hua, F [1 ]
Glazer, J [1 ]
机构：
[1] Hewlett Packard Co, Elect Assembly Dev Ctr, Palo Alto, CA 94304 USA
来源：
DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS | 1997年
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This paper gives an up to date literature review on the metallurgy of lead-free solders for electronic assembly. The review includes newly reported technical data on binary Sn-based eutectic alloys: Sn-Ag, Sn-Bi, Sn-Cu and Sn-In. It also reviews newly developed multicomponent solder alloys in the following systems: Sn-Zn-In, Sn-Zn-Bi, Sn-Zn-Sb, Sn-Ag-Zn, Sn-Ag-Cu, Sn-Ag-Bi, Sn-Ag-In, Sn-Bi-In, and Sn-Bi-Sb. The characteristics of these alloys described are chemical composition, physical properties, microstructure, and mechanical properties. The manufacturability issues for applications of these lead-free solders in low-cost electronic assembly are also presented.
引用
收藏
页码：65 / 73
页数：9
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