Interfacial reaction issues for lead-free electronic solders

被引:1
|
作者
C. E. Ho
S. C. Yang
C. R. Kao
机构
[1] Michigan State University,Department of Chemical Engineering & Materials Science
[2] National Central University,Department of Chemical & Materials Engineering
[3] National Taiwan University,Department of Materials Science & Engineering
关键词
Solder Joint; Ball Grid Array; Molten Solder; Under Bump Metallurgy; Kirkendall Void;
D O I
暂无
中图分类号
学科分类号
摘要
The interfacial reactions between Sn-based solders and two common substrate materials, Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu have been studied for several decades, and currently there are still many un-resolved issues. The reactions between Sn-based solders and Ni are equally challenging. Recent studies further pointed out that Cu and Ni interacted strongly when they were both present in the same solder joint. While this cross-interaction introduces complications, it offers opportunities for designing better solder joints. In this study, the Ni effect on the reactions between solders and Cu is discussed first. The presence of Ni can in fact reduce the growth rate of Cu3Sn. Excessive Cu3Sn growth can lead to the formation of Kirkendall voids, which is a leading factor responsible for poor drop test performance. The Cu effect on the reactions between solders and Ni is then covered in detail. The knowledge gained from the Cu and Ni effects is applied to explain the recently discovered intermetallic massive spalling, a process that can severely weaken a solder joint. It is pointed out that the massive spalling was caused by the shifting of the equilibrium phase as more and more Cu was extracted out of the solder by the growing intermetallic. Lastly, the problems and opportunities brought on by the cross-interaction of Cu and Ni across a solder joint is presented.
引用
收藏
页码:155 / 174
页数:19
相关论文
共 50 条
  • [1] Interfacial reaction issues for lead-free electronic solders
    Ho, C. E.
    Yang, S. C.
    Kao, C. R.
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 155 - 174
  • [2] Interfacial reaction of lead-free solders with lead-free finished leadframes
    Wong, Y. W.
    Wu, C. M. L.
    Woo, H. C. B.
    Choi, Y. T.
    Li, K. L.
    [J]. 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 412 - 417
  • [3] Tin pest issues in lead-free electronic solders
    W. J. Plumbridge
    [J]. Journal of Materials Science: Materials in Electronics, 2007, 18 : 307 - 318
  • [4] Tin pest issues in lead-free electronic solders
    Plumbridge, W. J.
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 307 - 318
  • [5] LEAD-FREE SOLDERS FOR ELECTRONIC ASSEMBLY
    VINCENT, JH
    HUMPSTON, G
    [J]. GEC JOURNAL OF RESEARCH, 1994, 11 (02): : 76 - 89
  • [6] Lead-free solders for electronic assembly
    Hua, F
    Glazer, J
    [J]. DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 65 - 73
  • [7] Composite lead-free electronic solders
    Guo, Fu
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 129 - 145
  • [8] Lead-free electronic solders - Preface
    Subramanian, K. N.
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 1 - 2
  • [9] Composite lead-free electronic solders
    Fu Guo
    [J]. Journal of Materials Science: Materials in Electronics, 2007, 18 : 129 - 145
  • [10] Lead-free solders and processing issues in microelectronics
    Raymond A. Fournelle
    [J]. JOM, 2003, 55 : 49 - 49