Microstructure and performance of SnAgCuEr lead-free solders with rare earth

被引：0
|
作者：
Tian, Jun [1 ]
Hao, Hu [1 ]
Shi, Yao-Wu [1 ]
Lei, Yong-Ping [1 ]
Xia, Zhi-Dong [1 ]
机构：
[1] School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
来源：
Cailiao Kexue yu Gongyi/Material Science and Technology | 2008年 / 16卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：281 / 283
相关论文
共 50 条
  • [31] Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls
    Yang Yu
    Zhidong Xia
    Fu Guo
    Yaowu Shi
    Journal of Electronic Materials, 2008, 37 : 975 - 981
  • [32] Effects of rare-earth addition on properties and microstructure of lead-free solder balls
    Yu, Yang
    Xia, Zhidong
    Guo, Fu
    Shi, Yaowu
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (07) : 975 - 981
  • [33] Getting ready for lead-free solders
    Indium Corp of America, Clinton, United States
    Soldering Surf Mount Technol, 26 (65-68):
  • [34] LEAD-FREE SOLDERS FOR ELECTRONIC ASSEMBLY
    VINCENT, JH
    HUMPSTON, G
    GEC JOURNAL OF RESEARCH, 1994, 11 (02): : 76 - 89
  • [35] Challenges in attaining lead-free solders
    Baskin, Philip
    Welding Journal (Miami, Fla), 2007, 86 (03): : 58 - 61
  • [36] INVESTIGATION OF MULTICOMPONENT LEAD-FREE SOLDERS
    LOOMANS, ME
    VAYNMAN, S
    GHOSH, G
    FINE, ME
    JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) : 741 - 746
  • [37] Global update on lead-free solders
    Biocca, Peter
    Surface mount technology, 1999, 13 (06):
  • [38] Creep phenomena in lead-free solders
    V. I. Igoshev
    J. I. Kleiman
    Journal of Electronic Materials, 2000, 29 : 244 - 250
  • [39] Reliability Analysis of Lead-free Solders
    Lajimi, Amir M.
    Cugnoni, Joel
    Botsis, John
    WCECS 2008: WORLD CONGRESS ON ENGINEERING AND COMPUTER SCIENCE, 2008, : 397 - 401
  • [40] Test of Wettability of Lead-Free Solders
    Podzemsky, Jiri
    Urbanek, Jan
    2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY, 2011, : 53 - 56
12345