Fatigue behavior of BGA soldering under board level drop test

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作者：
Fudan-Samsung Packaging Reliability Joint Laboratory, Fudan University, Shanghai 200433, China [1 ]
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来源：
J. Shanghai Jiaotong Univ. Sci. | 2008年 / SUPPL.卷 / 141-144期
关键词：
Ball grid arrays;
D O I：
10.1007/s12204-008-0941-7
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