共 50 条
- [41] Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding Electronic Materials Letters, 2024, 20 : 326 - 336
- [43] Bonding Interface Materials Evolution of Intermediate In/Ag Layers for Low Temperature Fluxless Solder Based MEMS Wafer Level Packaging 2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 216 - +
- [45] Achieving high shear strength and bonding accuracy for diffusion bonding joint of TC4 alloy at low temperature based on SMAT process MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 895
- [47] Low temperature solid–liquid interdiffusion wafer and die bonding based on PVD thin Sn/Cu films Microsystem Technologies, 2017, 23 : 3893 - 3899
- [50] Low temperature solid-liquid interdiffusion wafer and die bonding based on PVD thin Sn/Cu films 2015 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2015,