Low temperature eutectic alloy bonding used in MEMS-based solid propellant microthrusters array

被引:2
|
作者
Ru, Chengbo [1 ]
Ye, Yinghua [1 ]
Xu, Jianbing [1 ]
Zou, Zhenyou [1 ]
Dai, Ji [1 ]
Zhu, Peng [1 ]
Shen, Ruiqi [1 ]
机构
[1] School of Chemical Engineering, Nanjing University of Science and Technology, Nanjing, China
关键词
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I
10.4028/www.scientific.net/KEM.645-646.184
中图分类号
学科分类号
摘要
Heat transfer - Solid propellants - Eutectics - Temperature
引用
收藏
页码:184 / 189
相关论文
共 50 条
  • [31] Influence of Bonding Conditions on Low-temperature Solid-state Bonding of Cobalt Based Nanocones
    Han, Silin
    Zhou, Zihan
    Hu, Hua
    Wu, Yunwen
    Hang, Tao
    Li, Ming
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [32] Low-Temperature Fabrication of Millimeter-Scale MEMS-Based Piezoelectric Ultrasonic Energy Harvesters for Medical Implants
    Tian, Xu
    Iordanidis, Theocharis Nikiforos
    Stemme, Goran
    Roxhed, Niclas
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2024, : 524 - 531
  • [33] A Temperature-Insensitive Resonant Low-Pressure Microsensor Based on AuSi Eutectic Wafer Bonding
    Zheng, Yu
    Chen, Deyong
    Wang, Junbo
    Chen, Jian
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (12) : 7005 - 7010
  • [34] Low-Temperature Solid-State Bonding Using Hydrogen Radical Treated Solder for Optoelectronic and MEMS Packaging
    Higurashi, Eiji
    Kawai, Hiromu
    Suga, Tadatomo
    Okada, Sakie
    Hagihara, Taizoh
    SEMICONDUCTOR WAFER BONDING 13: SCIENCE, TECHNOLOGY, AND APPLICATIONS, 2014, 64 (05): : 267 - 274
  • [35] Fabrication process of MEMS print head based on silicon-silicon low temperature direct bonding
    Zhai Y.
    Cai A.
    Zhang D.
    Han C.
    Li L.
    Huagong Xuebao/CIESC Journal, 2019, 70 (03): : 1220 - 1226
  • [36] Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
    Lee, Chengkuo
    Yu, Aibin
    Yan, Liling
    Wang, Haitao
    He, Johnny Han
    Zhang, Qing Xin
    Lau, John H.
    SENSORS AND ACTUATORS A-PHYSICAL, 2009, 154 (01) : 85 - 91
  • [37] Thermo-mechanical Design for On-orbit Verification of MEMS based Solid Propellant Thruster Array through STEP Cube Lab Mission
    Oh, Hyun-Ung
    Ha, Heon-Woo
    Kim, Taegyu
    Lee, Jong-Kwang
    INTERNATIONAL JOURNAL OF AERONAUTICAL AND SPACE SCIENCES, 2016, 17 (04) : 526 - 534
  • [38] LOW-TEMPERATURE INTEGRATION OF BULK PZT-5H FOR ENHANCING THE PERFORMANCE OF MEMS-BASED PIEZOELECTRIC ULTRASONIC ENERGY HARVESTERS
    Tian, Xu
    Iordanidis, Theocharis Nikiforos
    Stemme, Goran
    Roxhed, Niclas
    2024 IEEE 37TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS, 2024, : 749 - 752
  • [39] Solid phase diffusion bonding of Ti2A1Nb alloy and titanium matrix composites at low temperature
    Zhang Xun-ye
    Zhang Qiu-guang
    Lin Pan-pan
    Wang Chun-yue
    He Peng
    Lin Tie-song
    Long Wei-min
    CAILIAO GONGCHENG-JOURNAL OF MATERIALS ENGINEERING, 2021, 49 (01): : 95 - 103
  • [40] Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding
    Xie, Jiunan
    Hu, Hua
    Chen, Peixin
    Lei, Han
    Hu, Anmin
    Wu, Yunwen
    Li, Ming
    ELECTRONIC MATERIALS LETTERS, 2024, 20 (03) : 326 - 336