Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array

被引：18
|
作者：
Geng, Wenyan [1 ]
Chen, Zhuo [1 ]
Hu, Anmin [1 ]
Li, Ming [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China
来源：
MATERIALS LETTERS | 2012年 / 78卷
关键词：
3D package; Low temperature insertion bonding; Interfaces; Plastic deformation; Diffusion; Bonding strength;
D O I：
10.1016/j.matlet.2012.03.027
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A novel low temperature insertion bonding technology based on micro-nano cones array (MCA) for 3D package is introduced. Hot-pressure insertion bonding was performed below the melting point of the soft solder (160 degrees C to 200 degrees C), the MCA was embedded into the solder and a thin diffusion layer occurred along the interface. The bonding strength can meet the industrial criterion. We predicted a reasonable initial void shape of the bond interface, which was in good accordance with both experimental and numerical simulation results. In addition, it was found that mechanical interlocking and fast diffusion between the MCA and the solder were the main mechanisms of this bonding process. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：72 / 74
页数：3
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