Polishing Diamond Substrates using Gas Cluster Ion Beam (GCIB) Irradiation for the Direct Bonding to Power Devices

被引：0
|
作者：
Wang, Junsha [1 ]
Takeuchi, Kai [1 ]
Kataoka, Izumi [2 ]
Suga, Tadatomo [1 ]
机构：
[1] Meisei University, Collaborative Research Center, Tokyo,1918506, Japan
[2] Iipt Inc., Tokyo,1810013, Japan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
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中图分类号：
学科分类号：
摘要：
Diamonds - III-V semiconductors - Ion beams - Ions - Polishing - Power semiconductor devices - Silicon carbide - Substrates - Surface roughness
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页码：57 / 58
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