Calculation and Analysis of Influence Factors of Electrical Contact Resistances Inside Press-pack IGBT Device

被引:0
|
作者
Li, Hui [1 ]
Wang, Xiao [1 ]
Lai, Wei [1 ]
Yao, Ran [1 ]
Liu, Renkuan [1 ]
Li, Jinyuan [2 ]
机构
[1] State Key Laboratory of Power Transmission Equipment & System Security and New Technology (Chongqing University), Shapingba District, Chongqing,400044, China
[2] State Grid Smart Grid Research Institute, Changping District, Beijing,102209, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
Electrical contact resistances of the press-pack insulated gate bipolar transistor (IGBT) device directly affect electro-thermal distribution characteristics and operational reliability of the device. However, the existing contact resistance calculation methods rely on the semi-empirical model or the built-in model of the finite element software and fail to consider the influence of surface topography parameters. The electrical contact resistances cannot be calculated accurately. An electrical contact resistance model and influence laws of the press-pack IGBT device considering the influence of material surface morphology parameters and contact pressure were proposed. Firstly, a mathematical model of electrical contact resistance that takes into account material resistivity, contact pressure, roughness and microhardness parameters was established based on the electrical contact theory. Secondly, the parameters of the electrical contact resistance model were selected by analyzing the surface characteristics of the material. A finite element simulation model of a single-chip press-pack IGBT device was established. The contact pressure and electrical contact resistances of the device were calculated. The validity of the proposed model was indirectly verified by measuring the on-resistance of the device. Finally, the effects of contact pressure, chip resistivity and surface roughness on the electrical contact resistances were analyzed. The results show that the proposed electrical contact resistance model can accurately characterize the electrical contact resistances of the device compared with the built-in model of COMSOL software. The electrical contact resistances between the chip and the upper and lower molybdenum in the press-pack IGBT device are the largest. When the pressure is small, the electrical contact resistances change significantly due to the resistivity, roughness and pressure. © 2021 Chin. Soc. for Elec. Eng.
引用
收藏
页码:5320 / 5328
相关论文
共 25 条
  • [1] Study on the Method to Analyze the Electrical Contact Resistances of Press-Pack IGBT devices
    Wang, Xiao
    Li, Hui
    Yao, Ran
    Long, Haiyang
    Zhong, Yi
    Yu, Renze
    Li, Jinyuan
    2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 613 - 617
  • [2] Influence of Electrode Structure and Arrangement on Current Sharing Performance Inside a Multi-chip Press-pack IGBT Device (Part I): Analysis and Calculation
    Gu M.
    Cui X.
    Peng C.
    Tang X.
    Yang Y.
    Li X.
    Zhao Z.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (07): : 2318 - 2329
  • [3] Insulation Simulation Analysis of Press-Pack IGBT
    Liu, Yuzhe
    Jiao, Chaoqun
    Zhao, Zhibin
    Pang, Chengzong
    Fan, Yuanliang
    PROCEEDINGS OF 2019 IEEE 3RD INTERNATIONAL ELECTRICAL AND ENERGY CONFERENCE (CIEEC), 2019, : 1936 - 1940
  • [4] Influence of the External Busbar on Current Sharing Performance Inside a Multi-chip Press-pack IGBT Device
    Gu M.
    Cui X.
    Peng C.
    Tang X.
    Yang Y.
    Li X.
    Zhao Z.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (01): : 234 - 245
  • [5] Modeling and Analysis on Overall Fatigue Failure Evolution of Press-Pack IGBT Device
    Li, Hui
    Yao, Ran
    Lai, Wei
    Ren, Hai
    Li, Jinyuan
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (03) : 1435 - 1443
  • [6] Electrical Field Analysis of press-pack IGBTs
    Fu, Pengyu
    Zhao, Zhibin
    Cui, Xiang
    Zhang, Peng
    Han, Ronggang
    2017 IEEE SIXTH ASIA-PACIFIC CONFERENCE ON ANTENNAS AND PROPAGATION (APCAP), 2017,
  • [7] Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material
    Wang, Xiao
    Li, Hui
    Yao, Ran
    Lai, Wei
    Liu, Renkuan
    Yu, Renze
    Chen, Xianping
    Li, Jinyuan
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2022, 37 (05) : 5411 - 5421
  • [8] Thermal Analysis of Press-pack IGBT in Hybrid DC Circuit Breaker
    Zhuang, Weibin
    Wu, Yifei
    Wu, Yi
    Li, Rui
    Wu, Ming
    Yang, Fei
    PROCEEDINGS OF THE 2021 IEEE 16TH CONFERENCE ON INDUSTRIAL ELECTRONICS AND APPLICATIONS (ICIEA 2021), 2021, : 884 - 888
  • [9] Influence of Electrode Structure and Arrangement on Current Sharing Performance Inside a Multi-chip Press-pack IGBT Device (Part II): Experiment
    Gu M.
    Cui X.
    Peng C.
    Tang X.
    Han R.
    Li X.
    Zhao Z.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (10): : 3288 - 3296
  • [10] Effect of the thermal contact resistance on the heat dissipation performance of the press-pack IGBT module
    Huang, Zuoyi
    An, Tong
    Qin, Fei
    Gong, Yanpeng
    Dai, Yanwei
    Chen, Pei
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,