共 25 条
- [1] Study on the Method to Analyze the Electrical Contact Resistances of Press-Pack IGBT devices 2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 613 - 617
- [2] Influence of Electrode Structure and Arrangement on Current Sharing Performance Inside a Multi-chip Press-pack IGBT Device (Part I): Analysis and Calculation Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (07): : 2318 - 2329
- [3] Insulation Simulation Analysis of Press-Pack IGBT PROCEEDINGS OF 2019 IEEE 3RD INTERNATIONAL ELECTRICAL AND ENERGY CONFERENCE (CIEEC), 2019, : 1936 - 1940
- [4] Influence of the External Busbar on Current Sharing Performance Inside a Multi-chip Press-pack IGBT Device Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (01): : 234 - 245
- [6] Electrical Field Analysis of press-pack IGBTs 2017 IEEE SIXTH ASIA-PACIFIC CONFERENCE ON ANTENNAS AND PROPAGATION (APCAP), 2017,
- [8] Thermal Analysis of Press-pack IGBT in Hybrid DC Circuit Breaker PROCEEDINGS OF THE 2021 IEEE 16TH CONFERENCE ON INDUSTRIAL ELECTRONICS AND APPLICATIONS (ICIEA 2021), 2021, : 884 - 888
- [9] Influence of Electrode Structure and Arrangement on Current Sharing Performance Inside a Multi-chip Press-pack IGBT Device (Part II): Experiment Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2020, 40 (10): : 3288 - 3296
- [10] Effect of the thermal contact resistance on the heat dissipation performance of the press-pack IGBT module 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,